PostDoc Position on Wafer Bonding Physics for 3D Chip Integration, University of Twente, Netherlands
📋 About This Opportunity
Summary The University of Twente is offering a challenging 2-year postdoctoral position in the XUV Optics group. This project focuses on investigating the detailed physics behind wafer bonding, a key enabling technology for future 3D chip integration. The role involves developing and validating experimental methods to This opportunity was collected by Gabeshana from ResearchersJob. Organization: ResearchersJob. Please visit the original source for complete eligibility requirements, official notification, application instructions and the latest information.
🎯 Eligibility
/QualificationEducationPhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field.ExperienceExperience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials.Familiarity with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods.Skills & QualitiesInterest in connecting experimental results to physical models and quantitative data analysis.Enjoy hands-on experimental work and ability to work accurately with advanced